Semiconductor Packaging

High Precision Multi-chip Die Bonder

Product Feature

• Multi-chip bonding capability
- Auto bond-tool change, up to 4 bond-tool buffers
- Auto wafer change, up to 4 x 6” wafer ring
- Optional: Waffle pack, Gel-Pak, tray or by request
• Achieving ±3um XY placement accuracy
• Supports epoxy stamping and dispensing
• Automatic material handling system

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