Semiconductor Packaging
Ultrasonic Wire Bonder
Product Feature
• Long gantry XY axis for large working area
• Bond quality control and assessment
• Direct drive linear motor and flying vision systems improve efficiency
• Quickly change of ultrasonic bond head supports aluminum wire,φ aluminum ribbon and copper wire bonding
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Shenzhen Headquarters:Building 3, Yufengda Industrial Park, Guangming District, Shenzhen C₩ity, Guangdong Province, China
Reception Service Number:0755-23019639
Consultation Email:hongbin.ding@laserx.net & laserx.xs@laserx.net